ʻO Asia Pacific Field Programmable Gate Array (FPGA) Ka nui o ka mākeke e hoʻonui ma 13% CAGR ma o 2026

Wahi a ka Graphical Research hōʻike ulu ulu ulu hou i kapa ʻia ʻo “Asia Pacific Field Programmable Gate Array (FPGA) Ka nui o ka mākeke, na ka ʻenehana ʻenehana (<28 nm, 28 nm - 90 nm,> 90 nm), na Architecture (SRAM, Flash, Anti -fuse), Na ka hoʻonohonoho ʻana (Low-range FPGA, Mid-range FPGA, High-range FPGA), Na ka Noi (Consumer Electronics, Automotive, Industrial, Communities & Data Center, Aerospace & Defense, Telecom), ʻoihana hōʻike ʻikepili, Regional ʻO Outlook (Kina, ʻInia, Iāpana, ʻAukekulia, Kōlea Hema), Loaʻa Loaʻa, Kūʻai Kūʻai Kūʻai & Wanana, 2020 - 2026 "Ka nui ma kahi o USD 5.5 biliona e 2026.

Hāʻawi ʻia ka ulu mākeke ʻo Asia Pacific FPGA i ka hoʻonui ʻana i ka hoʻokō ʻana o ka ʻenehana Internet of Things (IoT) i nā keʻena aupuni, nā panakō, a me nā ʻoihana i kēia wahi. Hāʻawi ʻo FPGA i nā pono he nui i nā polokalamu IoT e like me ka maʻalahi e hoʻopilikino i nā lakohana & lako polokalamu, palekana palekana, a hoʻonui i ka manawa i ka mākeke. ʻO kahi laʻana, hoʻolauna ke Aupuni o India i kahi papahana 'Smart City Mission' no ka hoʻomohala ʻana i nā ʻoihana kūlanahale me ka hoʻohana ʻana i nā ʻenehana AI & IoT. E hoʻonui paha kēia mau hana hoʻomohala i ka lawe ʻana i nā lako kamepiula i hoʻopili ʻia, e kākoʻo ana i ka ulu ʻana o ka mākeke i nā makahiki e hiki mai ana.

Hoʻolālā ʻia ka ʻenehana ʻenehana <28nm e ulu ma kahi CAGR ma mua o 14% ma ka mākeke FPGA Asia Pacific. Hāʻawi ʻia ka ulu ʻana i nā hoʻomaikaʻi paʻa a me nā hoʻomohala ʻana i ka hoʻolālā & ʻenehana o FPGA e hoʻomaikaʻi i ka ʻike o ka poʻe kūʻai. ʻO nā ʻoihana hana FPGA me Xilinx, Intel Corporation, a me Microchip Technology, me nā mea ʻē aʻe e hoʻomau mau nei i nā loli i nā ʻenehana hana i ka ʻāpana <28nm a me nā ʻenehana hou 7nm i kālepa maikaʻi ʻia ma ka mākeke.

Ke hōʻike nei ka ʻāpana hoʻonohonoho FPGA pae haʻahaʻa i kahi manawa ulu ulu nui i ka mākeke, e ulu ana ma kahi CAGR o 13% i ka manawa o ka wānana. Kuhi ʻia ka ulu ʻana o ka ʻāpana i ka hoʻonui ʻana i ka noi no nā mea hoʻohana i ka mana haʻahaʻa e like me nā uila uila, nā lako uila, nā kaʻa, a me nā mīkini kamepiula. Hāʻawi ka hoʻonohonoho FPGA haʻahaʻa haʻahaʻa i kekahi mau hiʻohiʻona me ka hoʻoliʻiliʻi paʻakikī i ka puʻupuʻu, ka haʻahaʻa haʻahaʻa haʻahaʻa, a me ka pono o ka mana kiʻekiʻe.

Hoʻolālā ʻia ka ʻāpana noi uila uila e hoʻonui ma kahi CAGR o 11% i ka wā wanana. Hoʻohana ʻia nā hāʻina FPGA i nā huahana uila uila e like me nā kāmela uila, nā kelepona uila, nā consoles pāʻani, a me nā kīwī akamai, a me nā mea ʻē aʻe. Ke nānā nei nā ʻoihana i ka hoʻokō ʻana o ka ʻenehana AI i nā lakohana uila uila e lawe i ka hoʻokaʻawale ʻana o ka huahana i kā lākou mōhai a hoʻonui i kā lākou noi i ka mākeke. ʻO kahi laʻana, i ka mahina ʻo Iune 2020, hui pū ʻo Intel Corporation me Udacity, Inc. e hoʻolauna i nā hopena FPGA i hoʻomākaukau ʻia no AI no nā hāmeʻa AI e like me nā kelepona, nā papa, a me nā mea ʻē aʻe.

Ke kī nui nei nā mea pāʻani ma ka mākeke ʻo Asia Pacific FPGA i ka hoʻomau ʻana i nā hana R&D a nānā i ka hoʻomohala ʻana i nā huahana a me nā mea hou e like me ke ala maikaʻi no ka hoʻonui ʻana o ka mākeke. ʻO kahi laʻana, i Nowemapa 2019, ua hoʻokumu ʻo GOWIN Semiconductor Corporation i nā mSoC FPGA me ka lekiō i hoʻohui ʻia ʻo Bluetooth 5.0 Low Energy, e hāʻawi ana i nā hiki i ka hoʻomākaukau ʻana i ka palena e pili ana i ka hoʻolālā FPGA ʻO kekahi o nā mea pāʻani nui i ka mākeke ʻo AGM Micro, Gowin Semiconductor Corp., Shenzhen Pango Microsystems, Taiwan Semiconductor Manufacturing Company (TSMC), a me Xian Intelligence Silicon Tech, a me nā mea ʻē aʻe.

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